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Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
Reflow soldering
Recommended temperature characteristic for reflow soldering following J-STD-020C
B572**V2
Profile feature
Average ramp-up rate
(T Smax to Tp)
Preheat
- Temperature min (T Smin )
- Temperature max (T Smax )
- Time (t Smin to t Smax )
Time maintained above:
- Temperature min (T L )
- Time (t L )
Peak/ classification
temperature (T p )
Time within 5 ° C of actual
peak temperature (t p )
Ramp-down rate
Time 25 ° C to peak
temperature
Sn-Pb eutectic assembly
3 ° C/ second max.
100 ° C
150 ° C
60 ... 120 seconds
183 ° C
60 ... 150 seconds
220 ° C ... 240 ° C
10 ... 30 seconds
6 ° C/ second max.
6 minutes max.
Pb-free assembly
3 ° C/ second max.
150 ° C
200 ° C
60 ... 180 seconds
217 ° C
60 ... 150 seconds
240 ° C ... 260 ° C
20 ... 40 seconds
6 ° C/ second max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Please read Cautions and warnings and
Important notes at the end of this document.
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